Since 1997 Excel Eltech Design Center has been offering a range of services in the field of design and
production of Integrated Circuits. The Services range from feasibility studies,
consultancy and initial specification, modeling, design in VHDL or Verilog,
FPGA/ASIC implementation, simulation and verification, up to delivery of
approved production volumes. Excel Eltech has adequate experience in System on Chip
(SoC) design, including the integration of analog parts, sensors and other IP
blocks. The company maintains top bill design tools infrastructure. Excel Eltech is
an expert in multi vendor design flow. Application expertise is focused on
graphics, image processing and medical image visualization. Special services
include outsourcing of designers, customer training such as design flow, VHDL /
Verilog and the supply of specialized standard components.
 |
Services offered are:
- ASIC Design
- Digital, Analog and Mixed Signal
- Front-end-designs in VERILOG and VHDL
- Synthesis to Target Libraries
- Test-Vector Generation
- Design Verification
- DFT Services for Existing Blocks
- Layout and Back-End-Design
- Ship-Tape to target Foundries
|
 |
and :
- Chip Verification
- FPGA Customization
- Cell Library
- Synthesis to Target Libraries
- Foundry Specific cell Library Development
- Foundry services
- Tape to chip service
- Turnkey Solution
- Defining specs to chip service
|
 |
Capabilities of ASIC design Engineers :
- Digital design-Front-end design, full custom design, Back-end design, Test Vector Generation, Testing of Chips
- Analog design-Designs using Standard Cells Front-end, layout, testing
- Mixed Signal-Using Standard Cells
- RF-capabilities upto 93 GHz
|
A fabless company, specializes in mixed-signal IC design, ASIC design, full custom, semi-custom,
standard cell based, systems on a chip SOC), hard and soft IP transfers and
FPGA, with digital, analog, mixed signal and RF capabilities. We offer cost
effective IC design as well as IP development services in CMOS technology. Our
geographic location allows us to design at very competitive pricing. Samples of
hard IP transfer work: 1394, RSA, sigma-delta modulator, neural-net engines,
fiber optic preamplifier, etc.
Capabilities of Design Centre :
- Asic Feasibility
 |
Our feasibility studies cover the complete development cycle from concept,
technology choice, requirements, cost and schedule ... providing you with a dependable, realistic development plan.
This plan will not only help to steer up your business investment decisions,
but also assist you in communicating the benefits of your project to your management and/or your customers,
which will increase their confidence in your abilities to deliver successful products. |
- Circuit Design
 |
With years of experience using “top-down” design methods, we can assist you in
decomposing your ASIC requirements into small functional blocks that
can be easily understood. We can design functional blocks if needed,
however, we have hundreds of functional blocks that have been
proven in production and can be re-used if appropriate. Each
functional block, selected or designed, is then simulated over
process cases and temperature to ensure that performance
requirements will be consistently met in high volume production.
Finally, simulation results as well as non-simulable effects for the
completed ASICs are reviewed and a detailed chip layout plan is
proposed to ensure the layout to meet your needs, and be completed on schedule
|
- Chip Layout
 |
Using standardized heights, row pitches,
and power supply busing, AMPEL produces very modular and flexible layouts
that are assembled in minimum time with minimal errors, hence facilitating
the Layout Versus Schematic (LVS) checking and achieving first-time silicon success.
AMPEL complements commercial CAD tools with its internal proprietary CAD tools that
can be adjusted quickly for special needs. In this way, labor-intensive error
prone activities are avoided, resulting in lower risk, as well as savings of
time and money, to you. |
- Wafer and Package Testing
 |
All of our wafer
and package testing is designed for
100% fault coverage. The tests are
defined with a series of test
conditions, with each test
condition defining the state of
every pin in terms of voltage,
current and loading. The tested
pin’s voltage or current
measurement is compared to test
limits obtained from the
simulations described in the
“Circuit Design” section. In that
the ASIC is also simulated in the
system application with the same
case models as the test
requirements, functionality in the
system is assured. Testing is
performed with custom modular test
equipment that can easily be
adapted to many special needs, such
as high voltages, high currents,
mixed-signals, etc., to meet your
special needs. You can be confident
of the performance of the ASICs
that ennoble your system. |
- Packaging
 |
In that AMPEL’s
main expertise is in electronics,
items such as packing (which is
primarily mechanical in nature) are
outsourced. We have experience with
several packaging houses, and can
work with any package house of your
choice. Our ICs have been packaged
in plastic dual in line (DIL), quad
flat packs (QFP), and ceramic
packages of various pin
configurations. |
- Fabrication
 |
In that AMPEL’s
main expertise is in electronics,
items such as wafer processing
(which is primarily chemical in
nature) are outsourced. We have
experience with several wafer
fabrication facilities (FABs), and
can work with any package house of
your choice. FAB used include
junction isolated complimentary
bipolar up 10 to 90 volts,
dielectric isolated DMOS up to 300
volts, and BiCMOS 5 to 10 volts,
and Ft up to 20 GHz. |
|